Facility Snapshot

Form Factor

Ø 2.5 m × 4 m cylindrical shell (fits a 4 m payload fairing).

Launch Mass

< 6 t fully loaded — single ride on Falcon 9, Ariane 6 or LM 5B.

Clean Environment

ISO Class 6 interior; positive N₂ purge; modular HEPA cassettes.

Automation

1 × dual‑arm cobot (ABB YuMi class) for wafer handling & cassette loading.

Power Draw

< 15 kW peak (process) / 4 kW idle — compatible with 10 kW solar array + battery.

Core Equipment Stack

2 × Rapid Thermal Processors (RTP) – 200 mm, 1 200 °C, N₂/O₂/H₂O ambient.
Laser Annealing Station – KrF 248 nm, 0.6 J cm^‑2, 300 mm × 300 mm scan field.
Wet Bench – HF last, RCA SC‑1/SC‑2, spin‑on dopant dispense.
Spin Coater & Hotplate – photo‑resist & SOD.
Maskless Direct Writer – 5 µm contact lithography.

Radiation‑Hard by Physics — bipolar differential pairs have negligible single‑event upset, perfect for LEO/GEO avionics.
Ultra‑Low Jitter — constant tail current, no saturation.
Temperature Resilience — maintains sub‑ns delay from ‑55 °C to +125 °C.
Space Logistics — full fab ships in one rocket launch, enabling on‑orbit or lunar additive manufacturing of ASICs.